Design and Development

Our Research and Development (R&D) services always engage with customer from concept design, develop product together up to stage of delivery prototype and delivery to Forth EMS for manufacturing. Our R&D team for product design integrate the circuit design, power design, housing design and software design with over 100 experienced R&D members in wide range of product design to assist on full range of service for customers’ requirement. Forth EMS ensures the best solution from design for manufacturing at high quality and competitive cost.


New Product Introduction (NPI)

Due to modular production line, Forth EMS is capable in NPI in which leading the pilot run, test run and mass run production on full assembly process starting from PCBA to Box-build. The high mixed products can be served through flexibility line layout and modular production. Due to fast moving in world-wide, we believe that our flexibility and adaptability will enhance the services to customers in cost effective way. Whether you need the most flexible services or high mass production, Forth EMS capable of serving you.

In addition, the re-invested earning do not end up in only advance machinery technology, but also in Human Resource and IT system to keep up with the world standard. For instance, our latest ERP and MRP tools are SAP system which we implemented for sale, production and material management.

Our mission is to provide customer satisfaction, best price point, quality, services and long term relationship with wide range products and order quantity support both NPI and mass production.



Manufacturing capacity :

High technology 16 SMT Lines and 6 AI machines; on average 250 million parts per month
3 auto wave soldering 4,500 standard board per day
1 selective soldering 1,500 standard board per day
6 Final assembly 2,000-5,000 complete sets / day

Testing and Inspection Capability :

X-ray [2D,3D]
SPI [3D]and AOI [2D,3D, In-line and desk top]
Burn-in Chambers, shock temp test
Power Burning
Full inspection system: IQC, IPQC, OQC
FA equipment support and BGA rework station
Dry and PIY and cross section
Test System development

Manufacturing Capability :

Build-to-Order / Configure-to-Order (BTO/CTO)
New product Introduction (NPI)
High-Mix, Low-Volume/Low-Mix, High-volume
Wide range PCBA Capability
No-Clean Processes with Nitrogen [N2] soldering.
Surface mount technology (SMT) and Auto Insertion (AI)
Through hole assembly
Final assembly
Lead free (Pb free, ROHS)
0603 chip, micro BGA and all SMD
Traceability system