Manufacturing
Manufacturing Capacity
- High technology 16 SMT Lines and 6 AI machines; on average 250 million parts / month
- 3 auto wave soldering 4,500 standard board / day
- 1 selective soldering 1,500 standard board / day
- 6 Final assembly 2,000-5,000 complete sets / day
- Build-to-Order / Configure-to-Order (BTO/CTO)
- New product Introduction (NPI)
- High-Mix, Low-Volume / Low-Mix, High-volume
- Wide range PCBA Capability
- No-Clean Processes with Nitrogen [N2] soldering.
- Press-Fit
- Surface mount technology (SMT) and Auto Insertion (AI)
- Through hole assembly
- Final assembly
- Lead free (Pb free, ROHS)
- 0603 chip, micro BGA and all SMD
- Traceability system
Testing and Inspection Capability
- X-ray [2D,3D]
- SPI [3D]and AOI [2D,3D, In-line and desk top]
- ICT and FCT
- Burn-in Chambers, shock temp test
- Power Burning
- Full inspection system: IQC, IPQC, OQC
- FA equipment support and BGA rework station
- Dry and PIY and cross section
- Test System development
Engineering Capability
- Flexibility machine configuration and line balancing to fit with customer’s products and process
- Improving machine program to the best output
- Maintenance and repairing machine
- Machine accuracy measurement and improve CPK>5 and to meet target and low defect in process, less down time
- Component and Process Engineering
- Product, Quality and Testing Engineering
- Failure Analysis
Technology
- Surface Mount Technology, Auto Insertion and Through Hole Technology [Wave soldering and selective soldering ] for PCBA level
- Electronic device BOX-Built and Testing
- Barcode system and Traceability program
- Lead-Free Processes
- BGA, micro BGA, PGA and LGA
Logistic Services
- Global standard packing
- Local delivery services to customer’s site
- Export delivery services
- Direct order fullfilment
- Warehousing and distribution
- Post-Manufacturing Repair Warranty
Certifications
- ISO 9001
- IATF 16949 (TS16949)
- ISO 14001
- OHSAS 18001
- IPC-A 610